A firm solder contact asks to use to go up Xi Liang is good, the soldering-iron head that keeps good, temperature is over the liquefacient temperature of soldering tin F of about 100 ° . The soldering tin improvement on soldering-iron head will be conducted from the fast heat of iron, warm-up workpiece. Build good flow and frit wet (Wetting) asks warm-up. The solder that has good solderability feature dish, aperture and component bring a foot to will conduce to good solder contact is formed inside the shortest time. Below elevatory temperature, time weak point is the loss that avoids pair of substrate, right solder dish the injure and grows between overmuch metal key with substrate joint. Expose mix in soldering tin / or the repetition over the liquefacient temperature of the Tg of substrate the soldering tin dot in temperature loop, the likelihood is sufferred but * sex accumulates demote. Best method is to be in little finish solder contact within the time of 5 seconds, had better be about 3 seconds. This time includes to ask to produce connective place to be necessary to operate.
Process
A commendatory handiwork solders the program is, apace heat and go up soldering-iron head contact of stannum takes core stannum line (Cored Wire) , contact solder contact area next, with fused soldering tin the help arrives from iron the original heat of workpiece is conducted. Removed stannic line next will contact solder exterior soldering-iron head. Some people are recommended make soldering-iron head contact above all foot / solder dish; Put stannic line in soldering-iron head and cite a base between, form hot bridge; Next the opposite that apace moves stannic line to solder contact area. A kind of any methods, if be finished correctly, will give out satisfactory result.
The purpose of these two kinds of technologies is to should assure to bring foot and solder dish temperature is enough and fused stannic line, form the joint between the metal of a requirement. During if be in,solder contact is formed, iron is contacted directly and fused stannum line, is that hurry added embrace provide for of the Chan that seek rice huller to exemplary of the caries that return locust accumulate is abb of of of Ju of of Gou Yao liver foolish does dusk add the provide for that embrace Chong to exemplary Dang of of Huang Qin Niao? Wet) arrives solder dish (Pad) , solder aperture (Barrel) and cite a base (Lead) . Carry out when process correct when, aid welding flux to will fuse and flow in the surface that will solder at soldering tin first, foreclose surface, because this soldering tin will be in apparently frit is wet with flow, enter aperture, form joint. Build and sufficient soldering tin flow forms the solder contact of a hope, stannic line and subsequently iron removed from solder contact area namely.
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